Method of manufacturing semiconductor package
AssigneeSamasung Electronics Co., Ltd.
InventorsHee-Jin Lee, Joong-Hyun Baek
Life of this patent
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Abstract
Provided are a semiconductor package of a semiconductor chip, a semiconductor module, an electronic system, and methods of manufacturing the same. The method includes mounting a semiconductor chip on a package substrate, forming a molding member on the semiconductor chip, forming via holes penetrating the molding member to expose a portion of a top surface of the semiconductor chip, the via holes being arranged in a lattice shape in a plan view, and forming thermally conductive via plugs in the via holes.
Claims18
A method of manufacturing a semiconductor device, comprising:
- mounting a semiconductor chip on a package substrate;
- forming a molding member on the semiconductor chip;
- forming via holes penetrating the molding member to expose a portion of a top surface of the semiconductor chip, the via holes being arranged in a lattice shape in a plan view;
- forming sub-holes between the via holes, the sub-holes being not to expose the top surface of the semiconductor chip;
- and
- forming thermally conductive via plugs in the via holes.
A method of manufacturing a semiconductor package, comprising:
- mounting a semiconductor chip having a plurality of thermal pads on a package substrate;
- forming a molding member to cover the semiconductor chip on the package substrate;
- forming a plurality of holes in the molding member, at least one of the plurality of holes exposing the thermal pads;
- mounting thermally conductive materials on the plurality of holes;
- and
- reflowing the thermally conductive materials to fill the plurality of holes with thermally conductive via plugs.
A method of manufacturing a semiconductor package, comprising:
- preparing a package substrate having an upper conductive pad thereon;
- mounting a semiconductor chip having a thermal pad and a chip pad;
- electrically connecting the upper conductive pad with the chip pad via a connection member;
- encapsulating the semiconductor chip and the connection member using a molding member;
- forming a via plug penetrating the molding member to be directly in contact with the thermal pad;
- forming a sub-plug in the molding member not to be in contact with the thermal pad,
- wherein the via plug and the sub-plug are materially in continuity with each other.
Dependencies are inferred from the claim text.