US 8,524,537 B2 · Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue

Abstract

A semiconductor device has a build-up interconnect structure formed over an active surface of a semiconductor wafer containing a plurality of semiconductor die separated by a saw street. An insulating layer is formed over the interconnect structure. Bumps are formed over the interconnect structure. A protective coating material is deposited over the insulating layer and saw street. A lamination tape is applied over the coating material. A portion of a back surface of the semiconductor wafer is removed. A mounting tape is applied over the back surface. The lamination tape is removed while leaving the coating material over the insulating layer and saw street. A first channel is formed through the saw street extending partially through the semiconductor wafer. The coating material is removed after forming the first channel. A second channel is formed through the saw street and the mounting tape is removed to singulate the semiconductor wafer.

Claims28

Dependent claims

A method of making a semiconductor device, comprising:

providing a semiconductor wafer including a plurality of semiconductor die separated by a saw street;
forming a build-up interconnect structure over a first surface of the semiconductor wafer;
forming a first insulating layer over the build-up interconnect structure;
forming a plurality of bumps over the build-up interconnect structure;
depositing a protective coating material over the first insulating layer and the saw street;
applying a lamination tape over the protective coating material and the bumps;
removing a portion of a second surface of the semiconductor wafer opposite the first surface of the semiconductor wafer;
removing the lamination tape while leaving the protective coating material over the first insulating layer and the saw street;
forming a first channel through the saw street extending through the build-up interconnect structure and partially but not completely through the semiconductor wafer after removing the lamination tape;
and
removing the protective coating material after forming the first channel.

8 more elements

Dependencies are inferred from the claim text.

Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue

Life of this patent

Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue

Life of this patent

Abstract

Claims28