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US 8,524,535 B2Granted
Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
AssigneeIbiden Co., Ltd.
InventorsHajime Sakamoto, Dongdong Wang
Life of this patent
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Abstract
A transition layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on an aluminum pad 24, it is possible to prevent a resin residue on the pad 24 and to improve connection characteristics between the die pad 24 and a via hole 60 and reliability.
Claims16
A method of manufacturing a multilayer printed circuit board, comprising:
- forming a die pad on each of a plurality of semiconductor devices;
- forming a protective film on the die pad of each of the semiconductor devices;
- forming an opening portion in the protective film such that the die pad of each of the semiconductor devices is exposed;
- forming an intermediate layer on the die pad of each of the semiconductor devices such that the intermediate layer extends to the die pad through the opening of the protective film and has a thickening layer formed over a surface of the protective film;
- placing the plurality of semiconductor devices in a plurality of through holes formed in a core substrate, respectively, after the forming of the intermediate layer on the die pad of each of the semiconductor devices;
- forming a buildup layer on said core substrate;
- and
- cutting the core substrate into a plurality of multilayer printed circuit boards.
5 more elements
Dependencies are inferred from the claim text.