System and method for improving solder joint reliability in an integrated circuit package
AssigneeSTMicroelectronics S.r.l.
InventorsAnthony M. Chiu, Tong Yan Tee
Life of this patent
Estimating the term…
Abstract
Solder joint reliability in an integrated circuit package is improved. Each terminal of a quad, flat, non-leaded integrated circuit package is formed having portions that define a solder slot in the bottom surface of the terminal. An external surface of the die pad of the integrated circuit package is also formed having portions that define a plurality of solder slots on the periphery of the die pad. When solder is applied to the die pad and to the terminals, the solder that fills the solder slots increases the solder joint reliability of the integrated circuit package.
Claims20
A method for manufacturing an integrated circuit package, the method comprising:
- forming at least a first solder slot in a bottom surface of at least one terminal of the integrated circuit package;
- and
- forming a die pad having a plurality of second solder slots in a bottom surface of the die pad, each of the first and second solder slots comprising a region recessed with respect to surrounding regions of the respective terminal and die pad and configured to be filled with solder in forming a conductive connection,
- wherein the plurality of second solder slots are positioned outside of a perimeter of an integrated circuit die mounted on the die pad.
A method of forming an integrated circuit package, the method comprising:
- forming a plurality of terminals, wherein each terminal has portions that form a first solder slot in a bottom surface of the respective terminal;
- and
- forming a die pad having a plurality of second solder slots in a bottom surface of the die pad, each of the first and second solder slots comprising a region recessed with respect to surrounding regions of the respective terminal and die pad and configured to be filled with solder in forming a conductive connection,
- wherein the plurality of second solder slots are positioned outside of a perimeter of an integrated circuit die mounted on the die pad.
A method of forming an integrated circuit package, comprising:
- forming an integrated circuit die;
- forming a die pad, the integrated circuit die mounted on the die pad, the die pad having a plurality of first solder slots in a bottom surface of the die pad;
- and
- forming a terminal having a second solder slot in a bottom surface of the terminal, each of the first and second solder slots comprising a region recessed with respect to surrounding regions of the respective terminal and die pad and configured to be filled with solder in forming a conductive connection,
- wherein the plurality of first solder slots are positioned outside of a perimeter of the integrated circuit die mounted on the die pad.
Dependencies are inferred from the claim text.