Flexible semiconductor package and method for fabricating the same

A method for fabricating a flexible semiconductor package, the method comprising the steps of:

• forming a wiring over a flexible substrate having a data chip and a control chip formed thereover;
• electrically connecting first bonding pads of the data chip to the wiring, wherein the data chip includes a data storage unit for storing data, wherein the wiring and the first bonding pad of the data chip are electrically connected by a first bump;
• electrically connecting second bonding pads of the control chip to the wiring, wherein the control chip includes a data processing unit for processing the data in the data chip, wherein the wiring and the second bonding pad of the control chip are electrically connected by a second bump;
• and
• forming a flexible protection member for covering the data chip and the control chip over the flexible substrate,
• wherein the wiring includes a first coupling recess and a second coupling recess, wherein the first bump is inserted in the first coupling recess to increase a contact area between the wiring and the first bump, and the second bump is inserted in the second coupling recess to increase a contact area between the wiring and the second bump.