Brace for wire bond
AssigneeFreescale Semiconductor, Inc.
InventorsMeiquan Huang, Hejin Liu, Hanmin Zhang
Life of this patent
Estimating the term…
Abstract
An electrical connection includes a first wire having one end stitch bonded to a surface, such as the lead finger of a lead frame or the connection pad of a substrate. A second wire has a first end attached to the surface on a first side of the first wire and a second end attached to the surface on a second, opposing side of the first wire. The second wire acts as a brace that prevents the first wire from lifting off of the surface. If necessary, a third wire can be added that, like the second wire, acts as a brace to prevent the first wire from lifting off of the surface.
Claims13
A method of securing a bond wire to a surface, comprising:
- forming a first wire bond by attaching a first wire to the surface, wherein a mechanical connection and an electrical connection are created between the first wire and the surface;
- bonding a first end of a second wire to the same surface on one side of the first wire;
- and
- bonding a second end of the second wire to the same surface on a second, opposing side of the first wire such that the second wire prevents the first wire from lifting off of the surface,
- wherein the surface is a lead finger of a lead frame or a substrate bonding pad.
A method of securing a bond wire to a surface comprising:
- forming a first wire bond by attaching a first wire to the surface with a stitch bond;
- bonding a first end of a second wire to the same surface on one side of the first wire bond;
- and
- bonding a second end of the second wire to the same surface on a second, opposing side of the first wire such that the second wire prevents the first wire from lifting off of the surface,
- wherein the first and second wires are attached to the surface using a wire bonding apparatus and the surface is a lead finger of a lead frame or a substrate bonding pad.
An electrical connection, comprising:
- a first wire having one end thereof stitch bonded to a surface;
- and
- a second wire having a first end attached to the same surface on a first side of the first wire and a second end attached to the same surface on a second, opposing side of the first wire, wherein the second wire prevents the first wire from lifting off of the surface,
- wherein the surface is a lead finger of a lead frame or a substrate bonding pad.
Dependencies are inferred from the claim text.