Copper foil for printed circuit
AssigneeJX Nippon Mining & Metals Corporation
InventorsHideta Arai, Naoki Higuchi
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AssigneeJX Nippon Mining & Metals Corporation
InventorsHideta Arai, Naoki Higuchi
Estimating the term…
Provided is a copper foil for a printed circuit with an electrodeposited ternary-alloy layer composed of copper, cobalt and nickel formed on a surface of the copper foil, wherein the electrodeposited layer comprises dendritic particles grown on the copper foil surface, and the entire surface of the copper foil is covered with particles having an area as seen from above the copper foil surface of 0.1 to 0.5 μm2 at a density of 1000 particles/10000 μm2 or less, particles exceeding 0.5 μm2 at a density of 100 particles/10000 μm2 or less, and particles less than 0.1 μm2 as the remainder. Roughening particles formed dendritically in a roughening treatment based on copper-cobalt-nickel alloy plating are inhibited from shedding from the copper foil surface, and the phenomenon known as powder falling and uneven treatment are thereby inhibited.
A copper foil for a printed circuit with an electrodeposited ternary-alloy layer composed of copper, cobalt and nickel formed on a surface of the copper foil to be bonded to a resin substrate, wherein the electrodeposited layer has a surface comprising dendritic particles grown on and covering the copper foil surface, each of the dendritic particles having an outer edge defining an area, and wherein the dendritic particles of the electroplated layer consist of particles having outer edges each defining an area of 0.1 to 0.5 μm2 dispersed on the surface of the electrodeposited layer at a density of 1000 particles/10000 μm2 or less, particles having outer edges each defining an area exceeding 0.5 μm2 dispersed on the surface of the electrodeposited layer at a density of 100 particles/10000 μm2 or less, and a remainder of particles having outer edges each defining an area of less than 0.1 μm2 on the surface of the electrodeposited layer.
A copper clad laminate, comprising:
Dependencies are inferred from the claim text.