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US 8,524,376 B2Granted
Heat-resistant Sn-plated Cu-Zn alloy strip with suppressed whiskering
AssigneeJX Nippon Mining & Metals Corporation
InventorTakaaki Hatano
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AssigneeJX Nippon Mining & Metals Corporation
InventorTakaaki Hatano
Estimating the term…
In an Sn-plated strip in which a copper alloy containing 15 to 40 mass % of Zn in terms of an average concentration is used as an alloy strip and the layers of an Sn phase, an Sn—Cu alloy phase and an Ni phase constitute a plating film from the surface to the alloy strip, the Zn concentration of the surface of the Sn phase is adjusted to a range of 0.1 to 5.0 mass %. The alloy may further contain 0.005 to 3.0 mass % in total of an arbitrary constituent selected from Sn, Ag, Pb, Fe, Ni, Mn, Si, Al and Ti. Moreover, the alloy may be a copper base alloy containing 15 to 40 mass % of Zn, 8 to 20 mass % of Ni, 0 to 0.5 mass % of Mn and a balance of Cu and unavoidable impurities, and may further contain 0.005 to 10 mass % in total of the above arbitrary constituent. There is provided a Cu/Ni double layer base reflowed Sn-plated Cu—Zn alloy strip in which generation of whiskers is suppressed.
A Sn-plated Cu-Zn alloy strip in which generation of whiskers is suppressed, wherein a copper alloy containing 15 to 40 mass % of Zn in terms of an average concentration is used as an alloy strip, layers of an Sn phase, an Sn—Cu alloy phase and an Ni phase constitute a plating film in that order from an outer surface of the plating film to the alloy strip, and the Zn concentration of the outer surface of the Sn phase is in a range of 0.1 to 5.0 mass % and wherein the layers are formed by:
A manufacturing method of an Sn-plated strip in which generation of whiskers is suppressed, comprising successively subjecting a copper alloy containing 15 to 40 mass % of Zn in terms of an average concentration to the following steps:
Dependencies are inferred from the claim text.