Pipe module
AssigneeHitachi Plant Technologies, Ltd.
InventorsYoshio Oozeki, Satoshi Arai, Shigeharu Tsunoda, Taihei Yotsuya, Shizuo Imaoka
Life of this patent
Estimating the term…
Abstract
A temporary part is fixed to a base by using an adhesive layer to which fillers are mixed at a predetermined density. When the temporary part is heated, heat is applied to the fillers and the adhesive layer. At a temperature equal to or higher than the glass-transition temperature of the adhesive agent, the heated adhesive layer is thermally contracted so as to release remaining stress, and on the other hand, the heated fillers are thermally expanded. In this manner, the peel-off strength between the adhesive layer and the base (or the temporary part) is reduced, and the disassembly is facilitated.
Claims6
A pipe module comprising:
- a pipe;
- a temporary part for holding the pipe at a position;
- and a base to which the pipe and the temporary part are held,
- wherein the temporary part and the base are adhered to each other by an adhesive layer formed of an adhesive agent to which a filler is added, the adhesive agent being a two-component cold-setting epoxy adhesive agent or a two-component cold-setting acrylic adhesive agent having an elastic modulus at 25° C. is 0.1 GPa or higher, the adhesive layer being configured to have the properties that, by application of heat, the filler is thermally expanded, the adhesive layer is thermally contracted and space is generated between the adhesive layer and the temporary part or between the adhesive layer and the base by the application of heat.
Dependencies are inferred from the claim text.