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US 8,524,295 B2Granted
Thermally stable, high tensile strength encapsulated actives
AssigneeIntercontinental Great Brands LLC
InventorsNavroz Boghani, Petros Gebreselassie
Life of this patent
Estimating the term…
Abstract
In some embodiments there is a composition including a thermally stabilized active composition and a high molecular weight polymer. The thermally stabilized active composition is resistance to degradation at higher temperatures such as those used for conducting extrusion with high molecular weight polyvinyl acetate.
Claims17
A gum composition comprising:
- a composition comprising a heat-sensitive active and a first polymer having a molecular weight from about 9,000 to about 200,000, wherein the heat-sensitive active is at least partially encapsulated by the first polymer and the first polymer is selected from the group consisting of acrylic polymers and copolymers, carboxyvinyl polymers, polyamides, polystyrene, polyvinyl acetate, polyvinyl acetate phthalate, polyvinylpyrrolidone, and combinations thereof;
- and
- an encapsulating layer comprising a second polymer having a molecular weight higher than about 300,000, wherein the composition comprising the heat-sensitive active and the first polymer having a molecular weight from about 9,000 to about 200,000 is encapsulated in the encapsulating layer.
A method of preparing an encapsulated active composition comprising:
- (a) preparing a thermally stabilized active composition comprising a first polymer having a molecular weight from about 9,000 to about 200,000 and a heat-sensitive active;
- wherein the heat-sensitive active is at least partially encapsulated by the first polymer and the first polymer is selected from the group consisting of acrylic polymers and copolymers, carboxyvinyl polymers, polyamides, polystyrene, polyvinyl acetate, polyvinyl acetate phthalate, polyvinylpyrrolidone, and combinations thereof;
- (b) combining the thermally stabilized active composition with a second polymer having a molecular weight higher than about 300,000;
- (c) melting and extruding the thermally stabilized active composition with the second polymer having a molecular weight higher than about 300,000 to provide an encapsulated composition;
- and
- (d) forming the encapsulated composition to a particle size.
3 more elements
A composition comprising:
- (i) a composition comprising a heat-sensitive active and a first polymer having a molecular weight from about 9,000 to about 200,000, wherein the heat-sensitive active is at least partially encapsulated by the first polymer and the first polymer is selected from the group consisting of acrylic polymers and copolymers, carboxyvinyl polymers, polyamides, polystyrene, polyvinyl acetate, polyvinyl acetate phthalate, polyvinylpyrrolidone, and combinations thereof;
- and
- (ii) an encapsulating layer comprising a second polymer having a molecular weight higher than about 300,000, wherein the composition comprising the heat-sensitive active and the first polymer having a molecular weight from about 9,000 to about 200,000 is encapsulated in the encapsulating layer.
Dependencies are inferred from the claim text.