CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method

A CMP abrasive slurry for polishing insulation film comprising cerium oxide particles, a dispersant, a water-soluble polymer having amino groups on the side chains, and water,

• wherein the water-soluble polymer having amino groups on the side chains is a polymer prepared by polymerization of compounds comprising:
• at least one compound represented by the following General Formula (III):
• (in Formula (III), R10 represents a hydrogen atom, a lower alkyl group, a phenyl group, a benzyl group, a halogen-substituted lower alkyl group, or a cyano group;
• R11 and R12 each represent a hydrogen atom, a C1-C18 alkyl group, a lower hydroxyalkylene group, or an acyl group;
• and R11 and R12 may bind to each other, forming a morpholino, thiomorpholino, pyrrolidino, or piperidino group), and
• at least one compound selected from the group consisting of polymerizable amino compounds represented by the following General Formula (I):
• (in Formula (I), R1 represents a hydrogen atom, a lower alkyl group, a phenyl group, a benzyl group, a halogen-substituted lower alkyl group, or a cyano group;
• R2 represents a C1-C18 alkylene group;
• R3 represents a hydrogen atom or a C3-C18 alkyl group;
• and R4 represents a C1-C18 alkyl group), polymerizable amino compounds represented by the following General Formula (II):
• (in Formula (II), R5 represents a hydrogen atom, a lower alkyl group, a phenyl group, a benzyl group, a halogen-substituted lower alkyl group, or a cyano group;
• R6 represents a hydrogen atom or a C1-C18 alkyl group;
• R7 represents a C1-C18 alkylene group;
• R8 represents a hydrogen atom or a C2-C18 alkyl group;
• and R9 represents a C1-C18 alkyl group), N,N-dimethylaminoethyl acrylate, N,N-diethylaminoethyl acrylate, N,N-dimethylaminopropyl acrylate, N,N-diethylaminopropyl acrylate, N,N-dimethylaminopropyl methacrylate, N,N-diethylaminopropyl methacrylate, and N,N-dimethylaminopropyl methacrylamide,
• wherein the water-soluble polymer having amino groups on the side chains is a polymer prepared by polymerization of compounds consisting of (a) said at least one compound represented by the General Formula (III), and (b) said at least one compound selected from the group consisting of polymerizable amino compounds represented by the General Formula (I), polymerizable amino compounds represented by the General Formula (II), N,N-dimethylaminoethyl acrylate, N,N-diethylaminoethyl acrylate, N,N-dimethylaminopropyl acrylate, N,N-diethylaminopropyl acrylate, N,N-dimethylaminopropyl methacrylate, N,N-diethylaminopropyl methacrylate, and N,N-dimethylaminopropyl methacrylamide.

A CMP abrasive slurry for polishing insulation film comprising cerium oxide particles, a dispersant, a water-soluble polymer having amino groups on the side chains, and water,

• wherein the water-soluble polymer having amino groups on the side chains is a polymer prepared by polymerization of compounds comprising:
• at least one compound represented by the following General Formula (III):
• (in Formula (III), R10 represents a hydrogen atom, a lower alkyl group, a phenyl group, a benzyl group, a halogen-substituted lower alkyl group, or a cyano group;
• R11 and R12 each represent a hydrogen atom, a C1-C18 alkyl group, a lower hydroxyalkylene group, or an acyl group;
• and R11 and R12 may bind to each other, forming a morpholino, thiomorpholino, pyrrolidino, or piperidino group), and
• at least one compound selected from the group consisting of N-methylaminoethyl acrylate, N,N-dimethylaminoethyl acrylate, N-ethylaminoethyl acrylate, N,N-diethylaminoethyl acrylate, N-methylaminopropyl acrylate, N,N-dimethylaminopropyl acrylate, N-ethylaminopropyl acrylate, N-ethylaminopropyl acrylate, N,N-diethylaminopropyl acrylate, N-methylaminoethyl methacrylate, N-ethylaminoethyl methacrylate, N-methylaminopropyl methacrylate, N,N-dimethylaminopropyl methacrylate, N-ethylaminopropyl methacrylate, N,N-dimethylaminopropyl methacrylate, N-methylaminopropylacrylamide, N-ethylaminopropylacrylamide, N,N-diethylaminopropylacrylamide, N-methylaminopropyl methacrylamide, N,N-dimethylaminopropyl methacrylamide, N-ethylaminopropyl methacrylamide, and N,N-diethylaminopropyl methacrylamide,
• wherein the water-soluble polymer having amino groups on the side chains is a polymer prepared by polymerization of compounds consisting of said at least one compound represented by the General Formula (III) and said at least one compound selected from the group consisting of N-methylaminoethyl acrylate, N,N-dimethylaminoethyl acrylate, N-ethylaminoethyl acrylate, N,N-diethylaminoethyl acrylate, N-methylaminopropyl acrylate, N,N-dimethylaminopropyl acrylate, N-ethylaminopropyl acrylate, N-ethylaminopropyl acrylate, N,N-diethylaminopropyl acrylate, N-methylaminoethyl methacrylate, N-ethylaminoethyl methacrylate, N-methylaminopropyl methacrylate, N,N-dimethylaminopropyl methacrylate, N-ethylaminopropyl methacrylate, N,N-dimethylaminopropyl methacrylate, N-methylaminopropylacrylamide, N-ethylaminopropylacrylamide, N,N-diethylaminopropylacrylamide, N-methylaminopropyl methacrylamide, N,N-dimethylaminopropyl methacrylamide, N-ethylaminopropyl methacrylamide, and N,N-diethylaminopropyl methacrylamide.