Connecting film, and joined structure and method for producing the same

A method for producing a joined structure, comprising:

• pressure-bonding a first circuit member and a second circuit member together via a connecting film while the circuit members are being heated, to thereby join the circuit members with each other,
• wherein the connecting film, which electrically connects the first circuit member with the second circuit member having a nitrogen atom-containing film on a surface thereof facing the first circuit member, comprises:
• a first layer which is to be located at the first circuit member side, and
• a second layer which is to be located at the second circuit member side,
• wherein the first layer comprises a cationic curing agent and an epoxy resin, and the second layer comprises a radical curing agent, an acrylic resin and an epoxy compound,
• wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and
• wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than the minimum melt viscosity of the insulating organic resin layer.