Method of making a light emitting device
AssigneeToyoda Gosei Co., Ltd.
InventorYoshinobu Suehiro
Life of this patent
Estimating the term…
Abstract
A light emitting device has a light emitting element, a mounting portion and a sealing part. On the mounting portion, the light emitting element is mounted and a circuit pattern is formed to supply power to the light emitting element. The sealing part is formed on the mounting portion, sealing the light emitting element, and formed of a glass and a phosphor uniformly dispersed in the glass. The phosphor is adapted to emit a wavelength-converted light by being excited by a light emitted from the light emitting element.
Claims20
A method of making a light emitting device, comprising:
- mounting a light emitting element on a mounting portion;
- forming a phosphor layer near the mounting portion of the light emitting element;
- mixing a powder glass and a powder phosphor to produce a mixed powder such that the powder phosphor is dispersed in the powder glass;
- melting the mixed powder while reducing a volume of the mixed powder to produce a melt and then solidifying the melt to produce a phosphor dispersed glass;
- and
- slicing the phosphor dispersed glass into plates so as to form a glass sealing part, each of the plates having a thickness according to a thickness of the glass sealing part prior to bonding;
- bonding the glass sealing part to the mounting portion with the light emitting element mounted thereon to seal the light emitting element,
- wherein the bonding is conducted by hot pressing, and
- wherein the bonding is conducted such that a surface of the glass sealing part substantially parallel with a slicing direction of the slicing is bonded onto a substantially planar surface of the mounting portion.
A method of making a light emitting device comprising:
- mounting a light emitting element on a mounting portion, the mounting portion including a wall portion formed at an outer side of the mounting portion;
- forming a phosphor layer near the mounting portion of the light emitting element such that the phosphor layer extends to an edge of a circuit pattern disposed outside an area covered by the light emitting element, the circuit pattern formed so as to supply power to the light emitting element;
- mixing a powder glass and a powder phosphor to produce a mixed powder such that the powder phosphor is dispersed in the powder glass;
- arranging the mixed powder inside of the wall portion of the mounting portion such that the wall portion acts as a mold;
- and
- melting the mixed powder within the wall portion while reducing a volume of the mixed powder to produce a melt in a decompression high-temperature atmosphere and then solidifying the melt to produce a phosphor dispersed glass on the mounting portion and to bond the phosphor dispersed glass to the mounting portion with the light emitting element mounted thereon to seal the light emitting element.
A method of making a light emitting device, comprising:
- mounting a light emitting element on a mounting portion;
- forming a phosphor layer near the mounting portion of the light emitting element;
- mixing a powder glass and a powder phosphor to produce a mixed powder such that the powder phosphor is dispersed in the powder glass;
- melting the mixed powder while reducing a volume of the mixed powder to produce a melt and then solidifying the melt to produce a phosphor dispersed glass;
- and
- bonding the phosphor dispersed glass to the mounting portion with the light emitting element mounted thereon to seal the light emitting element,
- wherein the bonding is conducted by hot pressing,
- wherein the phosphor dispersed glass is sliced prior to the bonding, and
- wherein the phosphor dispersed glass bonded to the mounting portion comprises a plurality of phosphor dispersed glass layers.
Dependencies are inferred from the claim text.