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US 8,523,606 B2Granted
Test socket
AssigneeSamsung Electronics Co., Ltd.
InventorGui-Heum Choi
Life of this patent
Estimating the term…
Abstract
A test socket is provided including a socket board, socket pins and a guiding member. The socket pins are exposed to an upper surface of the socket board and are configured to be electrically contacted by external terminals of an object. The guiding member is disposed on an upper surface of the socket board and is arranged to guide the external terminals as a single unit to contact the external terminals with the socket pins. The guiding member is also configured to a center of the socket board with a center of the object.
Claims20
A test socket comprising:
- a socket board;
- socket pins exposed to an upper surface of the socket board and configured to be electrically contacted by solder balls of an object;
- and
- a guiding member disposed on the upper surface of the socket board, the guiding member configured in a shape to guide the solder balls of the object to contact the socket pins,
- wherein the solder balls are located under the object and the guiding member is configured to contact inner surfaces of the solder balls.
2 more elements
A test socket comprising:
- a socket board;
- socket pins exposed to an upper surface of the socket board and configured to be electrically contacted by solder balls of an object;
- and
- a guiding member disposed on the upper surface of the socket board, the guiding member configured to guide the solder balls of the object to contact the socket pins,
- wherein the solder balls are located under the object and the guiding member is configured to contact outer surfaces of the solder balls.
2 more elements
Dependencies are inferred from the claim text.