Component in processing chamber of substrate processing apparatus and method of measuring temperature of the component

A component in a processing chamber of a substrate processing apparatus, wherein a temperature of the component is measured, the component comprising:

• an abrasive surface which is exposed to an abrasive atmosphere and a nonabrasive surface which is not exposed to the abrasive atmosphere;
• a temperature measured portion including a surface at the abrasive surface side and a surface at the nonabrasive surface side, which are parallel to each other;
• and
• a coating portion which coats the surface of the temperature measured portion at the abrasive surface side,
• wherein the temperature measured portion is a temperature measured member inserted to a concave portion formed on the nonabrasive surface of the component in the processing chamber of the substrate processing apparatus,
• wherein a mirror surface finishing is performed on each of a surface of the temperature measured member at the abrasive surface side and a surface of the temperature measured member at the nonabrasive surface side.

A component in a processing chamber of a substrate processing apparatus, wherein a temperature of the component is measured, the component comprising:

• an abrasive surface which is exposed to an abrasive atmosphere and a nonabrasive surface which is not exposed to the abrasive atmosphere;
• a temperature measured portion including a surface at the abrasive surface side and a surface at the nonabrasive surface side, which are parallel to each other;
• and
• a coating portion which coats the surface of the temperature measured portion at the abrasive surface side,
• wherein the temperature measured portion is a part of the component in the processing chamber of the substrate processing apparatus, a mirror surface finishing is performed on each of the surface at the abrasive surface side and the surface at the nonabrasive surface side with respect to the part of the component in the processing chamber of the substrate processing apparatus, and the surface at the abrasive surface side, on which the mirror surface finishing is performed, is covered by the coating portion.

A component in a processing chamber of a substrate processing apparatus, wherein a temperature of the component is measured, the component comprising:

• an abrasive surface which is exposed to an abrasive atmosphere and a nonabrasive surface which is not exposed to the abrasive atmosphere;
• a temperature measured portion including a surface at the abrasive surface side and a surface at the nonabrasive surface side, which are parallel to each other;
• and
• a coating portion which coats the surface of the temperature measured portion at the abrasive surface side,
• wherein the temperature measured portion is a temperature measured member inserted to a cut-out portion formed on the nonabrasive surface of the component in the processing chamber of the substrate processing apparatus, a mirror surface finishing is performed on each of the surface of the temperature measured member at the abrasive surface side and the surface of the temperature measured member at the nonabrasive surface side, and the surface of the temperature measured member at the abrasive surface side is covered by a part forming the cut-out portion of the component in the processing chamber of the substrate processing apparatus.

A component in a processing chamber of a substrate processing apparatus, wherein a temperature of the component is measured, the component comprising:

• an abrasive surface which is exposed to an abrasive atmosphere and a nonabrasive surface which is not exposed to the abrasive atmosphere;
• a temperature measured portion including a surface at the abrasive surface side and a surface at the nonabrasive surface side, which are parallel to each other;
• and
• a coating portion which coats the surface of the temperature measured portion at the abrasive surface side,
• wherein the temperature measured portion is a temperature measured member attached to the nonabrasive surface of the component in the processing chamber of the substrate processing apparatus, a mirror surface finishing is performed on each of the surface of the temperature measured member at the abrasive surface side and the surface of the temperature measured member at the nonabrasive surface side, and the surface of the temperature measured member at the abrasive surface side is covered by the component in the processing chamber of the substrate processing apparatus.