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US 8,523,395 B2Granted
Light emitting diode lamp and method for manufacturing the same
AssigneeRohm Co., Ltd.
InventorsMasaru Igaki, Takao Iemoto, Hirotaka Shimizu
Life of this patent
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Abstract
A light emitting diode (LED) lamp includes a plurality of LED chips and a heat dissipation member configured to dissipate heat generated from the LED chips. The heat dissipation member includes a tubular unit having a constant cross-section perpendicular to an axial direction, and a plurality of fins, each of which extends outwardly from the tubular unit and extends in the axial direction, having a constant thickness in the axial direction.
Claims20
A light emitting diode (LED) lamp comprising:
- a plurality of LED chips;
- a circuit board configured to mount thereon the LED chips;
- a heat dissipation member configured to dissipate heat generated from the LED chips;
- a cover configured to enclosed the LED chips and to transmit light generated from the LED chips;
- and
- a bracket disposed between the heat dissipation member and the cover and configured to attach the cover to the heat dissipation member, the bracket being provided separately from the heat dissipation member,
- wherein the heat dissipation member includes:
- a tubular unit having a constant cross-section perpendicular to an axial direction, and
- a plurality of fins, each of which protrudes outwards from the tubular unit and extends in the axial direction, having a constant thickness in the axial direction, and
- wherein the circuit board is attached to one end of the heat dissipation member in the axial direction.
7 more elements
A method for manufacturing an LED lamp, the method comprising:
- forming an elongated member through an extrusion casting, wherein the elongated member includes a tubular unit having a constant cross-section perpendicular to an axial direction, and a plurality of fins, each of which protrudes outwards from the tubular unit and extends in the axial direction, having a constant thickness in the axial direction;
- cutting the elongated member at cross-section planes perpendicular to the axial direction, to thereby form a heat dissipation member;
- fixing LED chips to the heat dissipation member;
- and
- attaching a cover to the heat dissipation member through a bracket, wherein the cover is configured to enclosed the LED chips and to transmit light generated from the LED chips and the bracket is provided separately from the heat dissipation member and disposed between the heat dissipation member and the cover.
2 more elements
Dependencies are inferred from the claim text.