Method and apparatus for mounting a fluid ejection module

A method for mounting a fluid ejection module to a frame, comprising:

• attaching a first surface of a connector to the frame;
• positioning a mounting surface of the fluid ejection module adjacent to an opposing second surface of the connector, wherein at least one of either the mounting surface or the opposing second surface of the connector includes one or more recesses filled with an adhesive;
• aligning the fluid ejection module to the frame;
• and
• after aligning the fluid ejection module, curing the adhesive positioned between the mounting surface and the second surface of the connector thereby securing the fluid ejection module to the connector,
• wherein a portion of the mounting surface of the fluid ejection module and a portion of the second surface of the connector are in direct contact and the adhesive is positioned such that substantially all contraction of the adhesive during curing occurs perpendicular to the mounting surface.

A system comprising:

• a frame configured to mount one or more MEMS device assemblies;
• the one or more MEMS device assemblies, each MEMS device assembly including a mounting component having a mounting surface;
• one or more connectors configured to detachably attach to the frame and positioned between the frame and the mounting surfaces of the one or more MEMS device assemblies, wherein a portion of a mating surface of a connector positioned adjacent the mounting surface of a corresponding MEMS device assembly is in direct contact with the mounting surface;
• one or more recesses formed in at least one of either the mounting surfaces of the one or more MEMS device assemblies or the mating surfaces of the one or more connectors, where the one or more recesses have a substantially uniform thickness and are filled with an adhesive;
• and
• the adhesive comprising a substantially uniform layer formed within the one or more recesses, wherein the adhesive corresponding to a MEMS device assembly is cured after aligning the MEMS device assembly to the frame.

A system comprising:

• a frame configured to mount one or more fluid ejection modules;
• the one or more fluid ejection modules, each including a mounting component;
• a first connector detachably attached to the frame;
• a bracket having a first mating surface and a second mating surface, the first mating surface being positioned in contact with the first connector;
• a second connector detachably attached to the bracket and in contact with the mounting component;
• one or more recesses formed in at least one of either the first and second mating surfaces of the bracket or a mating surface of the one or more connectors, where the one or more recesses have a substantially uniform thickness and are filled with an adhesive;
• and
• the adhesive comprising a substantially uniform layer formed within the one or more recesses, wherein for each fluid ejection module, the adhesive at an interface between the first mating surface and the first connector is cured after aligning the bracket to the frame in a first direction, and the adhesive at an interface between the second mounting surface and the second connector is cured after aligning the fluid ejection module to the frame in a second direction and a third direction.