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US 8,523,071 B2Granted
Electronic assemblies and methods of forming electronic assemblies
AssigneeintelliPaper, LLC
InventorsAndrew DePaula, Larry Aamodt, Ronald Vyhmeister
Life of this patent
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Abstract
An electronic assembly includes an electronic device having high-resolution features and at least one conductive contact pad. The electronic assembly further includes a substrate supporting the electronic device and an electrical connection having low-resolution features. The electrical connection extends from the at least one conductive contact pad to a position upon the substrate.
Claims4
An electronic assembly comprising:
- a substrate, wherein the substrate comprises laminated paper having opposite sides;
- an electronic circuitry module secured to the substrate and comprising at least one conductive contact pad, wherein the electronic circuitry module comprises integrated circuitry having opposite sides substantially coplanar with the opposite sides of the laminated paper;
- and
- conductive ink electrically connecting the at least one conductive contact pad with a location on the substrate wherein at the location, the conductive ink is configured for ohmic connection with additional circuitry.
1 more element
Dependencies are inferred from the claim text.