Method and apparatus for cleaning a semiconductor substrate
AssigneeLam Research Corporation
InventorsErik M. Freer, John M. deLarios, Katrina Mikhaylichenko, Michael Ravkin, Mikhail Korolik, Fred C. Redeker
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Abstract
A method for cleaning a substrate is provided. The method initiates with disposing a fluid layer having solid components therein to a surface of the substrate. A shear force directed substantially parallel to the surface of the substrate and toward an outer edge of the substrate is then created. The shear force may result from a normal or tangential component of a force applied to a solid body in contact with the fluid layer in one embodiment. The surface of the substrate is rinsed to remove the fluid layer. A cleaning system and apparatus are also provided.
Claims6
A substrate cleaning system, comprising:
- a fluid reservoir configured to deliver a fluid having solid components to a surface of a substrate;
- a force transferring entity having a compliant membrane disposed over an outer surface, the force transferring entity being one of a bubble or a droplet, the compliant membrane configured to contact the fluid disposed on the surface of the substrate, the force transferring entity configured to provide a force having a normal component to thin a viscoelastic fluid layer defined between a bottom surface of one of the solid components and the surface of the substrate through expansion and contraction of the compliant membrane while contacting the fluid;
- and
- a substrate support configured to support the substrate under the force transferring entity.
Dependencies are inferred from the claim text.