Integrated circuit chip cooling using magnetohydrodynamics and recycled power
AssigneeOracle America, Inc.
InventorsChien Ouyang, Kenny C. Gross, Ali Heydari
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Abstract
Some embodiments of the present invention provide a system that cools an integrated circuit (IC) chip within a computer system. During operation, the system converts heat generated by a heat-generating device within the computer system during operation of the computer system into thermoelectric power. Next, the system supplies the thermoelectric power to drive a fluid pump. Finally, the system uses the fluid pump to conduct heat away from the IC chip.
Claims16
A method for cooling an integrated circuit (IC) chip within a computer system, comprising:
- converting heat generated by one or more heat-generating devices within the computer system during operation of the computer system into thermoelectric power from each of the heat-generating devices;
- combining the thermoelectric power from each of the heat-generating devices into an aggregate thermoelectric power;
- supplying the aggregate thermoelectric power to drive a fluid pump;
- using the fluid pump to conduct heat away from the IC chip;
- monitoring the operating temperature of the IC chip using a continuous system telemetry harness (CSTH);
- and
- controlling the flow rate of the fluid pump based on the monitored operating temperature by varying the number of heat-generating devices used to generate the aggregate thermoelectric power that drives the fluid pump.
A system for cooling an integrated circuit (IC) chip within a computer system, comprising:
- an energy-conversion mechanism configured to convert heat generated by one or more heat-generating devices within the computer system during operation of the computer system into thermoelectric power from each of the heat-generating devices;
- and;
- a combining mechanism configured to combine the thermoelectric power from each of the heat-generating devices into an aggregate thermoelectric power;
- a fluid pump configured to conduct heat away from the IC chip using the aggregate thermoelectric power;
- a monitoring mechanism configured to monitor the operating temperature of the IC chip using a CSTH;
- and
- a controlling mechanism configured to vary a flow rate of the fluid pump based on the monitored operating temperature by varying the number of heat-generating devices used to generate the aggregate thermoelectric power that is used to power the fluid pump.
Dependencies are inferred from the claim text.