Clustered stacked vias for reliable electronic substrates
AssigneeInternational Business Macines Corporation
InventorsKaran Kacker, Douglas O. Powell, David L. Questad, David J. Russell, Sri M. Sri-Jayantha
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Abstract
A method of fabricating a substrate via structure in a substrate/chip assembly includes steps of: disposing a center via stack for electrical interconnects in the substrate/chip assembly; and providing a plurality of stacked vias surrounding the center via stack. The plurality of stacked vias encircle the center via stack, resulting in no isolated via stacks on the structure. The plurality of stacked vias have both functional and non-functional vias.
Claims8
A method of fabricating a substrate via structure in a substrate/chip assembly, the method comprising steps of:
- disposing a center via stack for electrical interconnects in the substrate/chip assembly;
- and
- providing a plurality of stacked vias disposed around and surrounding the center via stack, wherein the plurality of the stacked vias encircle the center via stack, resulting in no isolated via stacks on the structure, said plurality of stacked vias comprising:
- functional vias supporting electrical interconnects;
- and
- non-functional vias that do not support electrical interconnects, said non-functional vias having a shorter height than the functional vias to accommodate a constrained surrounding;
- and
- providing a build-up layer within which the center via stack and the plurality of stacked vias are formed.
Dependencies are inferred from the claim text.