Method of manufacturing wiring board
AssigneeIbiden Co., Ltd.
InventorsMichimasa Takahashi, Masakazu Aoyama
Life of this patent
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Abstract
A method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.
Claims13
A method of manufacturing a wiring board comprising:
- forming a base substrate;
- forming a first insulation layer on a first surface of the base substrate and a second insulation layer on a second surface of the base substrate opposing the first surface;
- forming at least one via in at least one of the first or second insulation layers;
- and
- cutting the first insulation layer in a first area and cutting the second insulating layer in a second area offset from said first area, to form a first substrate laminated to a second substrate with the base layer interposed therebetween the second substrate having a smaller mounting area than a mounting area of the first substrate such that the first substrate extends beyond an edge of the second substrate wherein a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate is cut to be thinner than a portion of the base substrate sandwiched between the first substrate and the second substrate.
Dependencies are inferred from the claim text.