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US 8,522,428 B2Granted
Method for producing a sensor board
AssigneeNitto Denko Corporation
InventorsHiroyuki Hanazono, Hiroshi Yamazaki
Life of this patent
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Abstract
A method for producing a sensor board includes the steps of preparing an insulating layer; forming at least a pair of electrodes on the insulating layer; and forming a conductive layer by spraying a conductive component-containing liquid onto the insulating layer by an ultrasonic spray method so as to cover the electrodes.
Claims5
A method for producing a sensor board comprising the steps of preparing an insulating layer;
- forming at least a pair of electrodes on the insulating layer;
- and forming a conductive layer by spraying a conductive component-containing liquid onto the insulating layer by an ultrasonic spray method so as to cover the electrodes
- wherein the conductive component-containing liquid contains an organic solvent, and
- wherein the organic solvent in the conductive component-containing liquid evaporates by the time liquid droplets of the conductive component-containing liquid reaches the insulating layer during the ultrasonic spray method so that the conductive layer has a uniform thickness.
1 more element
Dependencies are inferred from the claim text.