Brittle non-metallic workpiece with through hole and method for making same
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsMu-Chi Hsu, Vladimir Stepanovich Kondratenko
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Abstract
An exemplary brittle non-metallic workpiece (80) defines a through hole (82). An inner surface (822) for forming the through hole has no microcracks and burrs. A method for making a through hole in a brittle non-metallic substrate (50) is also provided. The method includes as follows: forming an enclosing sketched etch (66) engraved into a brittle non-metallic substrate with a given depth (H) from a surface of the brittle non-metallic substrate; placing a cooling object (74) on an excess portion (68) inside the enclosing sketched etch (66); and extending the enclosing sketched etch through the brittle non-metallic substrate.
Claims6
A method for making a through hole in a brittle non-metallic workpiece, comprising:
- forming an enclosing sketched etch engraved into a brittle non-metallic substrate with a given depth from a surface of the brittle non-metallic substrate by a first laser beam and a coolant following the laser beam;
- heating a region surrounding the enclosing sketched etch by a second laser beam, a power density of the second laser beam being smaller than the power density of the first laser beam;
- changing a temperature of the region surrounding the enclosing sketched etch rapidly by placing a cooling object on an excess portion inside the enclosing sketched etch;
- and
- extending the enclosing sketched etch through the brittle non-metallic substrate.
Dependencies are inferred from the claim text.