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US 8,518,204 B2Granted
Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer
AssigneeLuxVue Technology Corporation
InventorsHsin-Hua Hu, Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law
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Abstract
A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.
Claims19
A method of fabricating a micro device comprising:
- bonding a first substrate stack to a second substrate stack with an intermediate electrically conductive bonding layer having a liquidus temperature of 350° C. or lower;
- patterning an active device layer of the first substrate stack to form a plurality of micro devices;
- heating a region of the intermediate electrically conductive bonding layer to the liquidus temperature or higher;
- picking up one of the plurality of the micro devices and a portion of the intermediate electrically conductive bonding layer with a transfer head;
- placing the micro device and the portion of the intermediate electrically conductive bonding layer on an electrically conductive receiving bonding layer on a receiving substrate;
- and
- bonding the intermediate electrically conductive bonding layer to the electrically conductive receiving bonding layer to form a permanent alloy bonding layer having a liquidus temperature above 150° C.
4 more elements
Dependencies are inferred from the claim text.