Semiconductor optical modulation device
AssigneeMitsubishi Electric Corporation
InventorNorio Okada
Life of this patent
Estimating the term…
Abstract
A temperature control module and a support block are mounted on a metal stem. A dielectric substrate is mounted on a side surface of the support block. A support block is mounted on a cooling surface of the temperature control module. A dielectric substrate is mounted on a side surface of the support block. A semiconductor optical modulation element is mounted on the dielectric substrate. A lead pin and a signal line are connected through a bonding wire. The signal line and a signal conductor are connected through a bonding wire. The signal conductor and the semiconductor optical modulation element are connected through a bonding wire.
Claims11
A semiconductor optical modulation device comprising:
- a metal stem;
- a lead pin that penetrates through the metal stem;
- a first support block that is mounted on the metal stem;
- a temperature control module that is mounted on the metal stem;
- a first dielectric substrate that is mounted on a side surface of the first support block;
- a second support block that is mounted on the temperature control module;
- a signal line that is formed on the first dielectric substrate;
- a second dielectric substrate that is mounted on a side surface of the second support block;
- a signal conductor that is formed on the second dielectric substrate;
- a semiconductor optical modulation element that is mounted on the second dielectric substrate;
- a first bonding wire that connects the lead pin to an end of the signal line;
- a second bonding wire that connects the other end of the signal line to an end of the signal conductor;
- and
- a third bonding wire that connects another end of the signal conductor to the semiconductor optical modulation element.
A semiconductor optical modulation device comprising:
- a metal stem;
- a lead pin that penetrates through the metal stem;
- a first dielectric substrate that is mounted on the metal stem via a side surface thereof;
- a temperature control module that is mounted on the metal stem;
- a support block that is mounted on the temperature control module;
- a signal line that is formed on the first dielectric substrate;
- a second dielectric substrate that is mounted on a side surface of the support block;
- a signal conductor that is formed on the second dielectric substrate;
- a semiconductor optical modulation element that is mounted on the second dielectric substrate;
- a first bonding wire that connects the lead pin to an end of the signal line;
- a second bonding wire that connects the other end of the signal line to an end of the signal conductor;
- and
- a third bonding wire that connects another end of the signal conductor to the semiconductor optical modulation element.
Dependencies are inferred from the claim text.