Systems employing a stacked semiconductor package

An electronic system comprising:

• a control unit;
• an input unit configured to transmit an electrical signal to the control unit,
• an output unit configured to receive the electrical signal from the control unit and to output a processing result of the electronic system;
• a storage unit configured to store data to be processed or already processed by the control unit;
• and
• a communication unit configured to receive the electrical signal from the control unit and to transmit or to receive the electrical signal to or from another electronic system,
• wherein at least one of the control unit, the input unit, the output unit, the storage unit, and the communication unit includes an apparatus, and
• the apparatus includes,
• a first substrate having a first land,
• a second substrate having a second land,
• a first molding compound disposed between the first substrate and the second substrate,
• a first semiconductor chip disposed on the first substrate and in contact with the first molding compound, wherein a surface of the first semiconductor chip is exposed,
• a first connector contacting the first land, and
• a second connector contacting the second land, the second connector disposed on the first connector, wherein a volume of the second connector is greater than a volume of the first connector, the first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.