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US 8,508,942 B2Granted
Electronic device with heat dissipation structure
AssigneesHONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., Hon Hai Precision Industry Co., Ltd.
InventorsBo Tian, Kang Wu
Life of this patent
Estimating the term…
Abstract
An electronic device includes an enclosure. The enclosure includes a motherboard area and a power supply area adjacent to the motherboard area, which are both located at a first end of the enclosure, a hard disk drive area for mounting hard disk drives at a second end of the enclosure, and a fan area arranged between the motherboard area and the hard disk drive area.
Claims3
An electronic device comprising:
- an enclosure comprising a motherboard area at a first end of the enclosure for mounting a motherboard, a power supply area at the first end and adjacent to the motherboard area for mounting a power supply, a hard disk drive area at a second end of the enclosure substantially opposite to the first end for mounting hard disk drives, and a fan area arranged between the motherboard area and the hard disk drive area;
- a first fan assembly arranged in the fan area, and comprising a plurality of first fans facing the motherboard area and the power supply area;
- and
- a second fan assembly arranged in the fan area, and comprising a plurality of second fans facing the hard disk drive area.
1 more element
Dependencies are inferred from the claim text.