Laminate type electronic component and manufacturing method therefor

A method for manufacturing a laminate type electronic component, the method comprising:

• a component main body preparation step of preparing a component main body having a stacked structure including a plurality of internal electrodes arranged in a stacking direction;
• and
• an external electrode formation step of forming plating films at least partially constituting external electrodes, directly on an outer surface of the component main body so as to be electrically connected to the plurality of internal electrodes;
• wherein
• the internal electrodes formed in the component main body prepared in the component main body preparation step each comprise a main section and an extending section extending from the main section, ends of the extending sections include exposed ends formed so as to be exposed in contact with the plating film at the outer surface of the component main body, each of the extending sections includes a cut that divides the exposed end into multiple sections, the plurality of cuts formed in the plurality of extending sections are aligned in the stacking direction of the component main body;
• the external electrode formation step includes a plating step of growing plated depositions deposited on the respective exposed ends at least in the stacking direction, thereby forming the plating films so as to form slits extending in the stacking direction at locations corresponding to positions of the cuts;
• and
• the method further comprises, after the plating step, a heat treatment step of subjecting the component main body to a heat treatment.