Peeling method and method for manufacturing display device using the peeling method

A method for manufacturing a display device, the method comprising the steps of:

• forming a metal film comprising tungsten and a metal oxide film comprising tungsten over a glass substrate;
• forming a peel-off layer over the metal film and the metal oxide film, the peel-off layer comprising a transistor, a first electrode in electrical contact with one of a source and a drain of the transistor, and an insulating layer;
• forming a water-soluble resin over the peel-off layer;
• fixing a tape over the water-soluble resin, the tape having a feature of deterioration in adhesiveness by being irradiated with an ultraviolet ray;
• separating the glass substrate from the peel-off layer by using a physical means;
• fixing a film substrate under the peel-off layer by using an epoxy resin system adhesive;
• irradiating an ultraviolet ray to the tape;
• separating the tape from the water-soluble resin;
• removing the water-soluble resin by using water;
• forming a light emitting layer on the peel-off layer by evaporation;
• forming a second electrode on the light emitting layer;
• forming a sealing film over the second electrode.

A method for manufacturing a display device, the method comprising the steps of:

• forming a metal film comprising tungsten and a metal oxide film comprising tungsten over a glass substrate;
• forming a peel-off layer over the metal film and the metal oxide film, the peel-off layer comprising a transistor, a first electrode, and an insulating layer comprising an organic material covering edge portions of the first electrode;
• forming a water-soluble resin over the peel-off layer;
• fixing a tape over the water-soluble resin, the tape having a feature of deterioration in adhesiveness by being irradiated with an ultraviolet ray;
• separating the glass substrate from the peel-off layer by using a physical means;
• fixing a film substrate under the peel-off layer by using an epoxy resin system adhesive;
• irradiating an ultraviolet ray to the tape;
• separating the tape from the water-soluble resin;
• removing the water-soluble resin by using water;
• forming a white light emitting layer on the peel-off layer by evaporation;
• forming a second electrode on the white light emitting layer;
• and
• forming a sealing film over the second electrode.

A method for manufacturing a light emitting device, the method comprising the steps of:

• forming a metal layer over a first substrate;
• forming a metal oxide film and a base film on the metal layer, the metal oxide film in contact with the metal layer;
• forming a semiconductor film over the base film;
• performing a thermal treatment to crystallize the metal oxide film and the semiconductor film;
• forming a source region and a drain region in the semiconductor film after having performed the thermal treatment;
• forming an electrode electrically connected to one of the source region and the drain region;
• forming an insulating layer covering an end of the electrode;
• fixing a second substrate over the insulating layer;
• separating the first substrate from the semiconductor film;
• fixing a third substrate under the semiconductor film;
• separating the second substrate from the electrode;
• forming a light emitting layer on the electrode;
• and
• forming a pixel electrode on the light emitting layer.

A method for manufacturing a light emitting device, the method comprising the steps of:

• forming a metal layer over a first substrate;
• forming a metal oxide film and a base film on the metal layer, the metal oxide film in contact with the metal layer;
• forming a semiconductor film over the base film;
• performing a thermal treatment to crystallize the metal oxide film and the semiconductor film;
• forming a source region and a drain region in the semiconductor film after having performed the thermal treatment;
• forming an electrode electrically connected to one of the source region and the drain region;
• forming an insulating layer covering an end of the electrode;
• fixing a second substrate over the insulating layer;
• separating the first substrate from the semiconductor film from the inside of the crystallized metal oxide film or from boundaries of both sides of the metal oxide film;
• fixing a third substrate under the semiconductor film;
• separating the second substrate from the electrode;
• forming a light emitting layer on the electrode;
• and
• forming a pixel electrode on the light emitting layer.