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US 8,508,412 B2Granted
Semiconductor package and semiconductor device
AssigneeRenesas Electronics Corporation
InventorHatsuhide Igarashi
Life of this patent
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Abstract
A semiconductor device, includes a chip, a first external terminal, a second external terminal, and a partial antenna wiring that is coupled to the first external terminal, and that constitutes a matching circuit, wherein the chip includes first and second electrode pads that are coupled to the partial antenna wiring, a third electrode pad that is different from each of the first and second electrode pads, and that is coupled to the second external terminal, and an electrostatic discharge (ESD) protection circuit that is coupled to the third electrode pad.
Claims19
A semiconductor device, comprising:
- a chip;
- a first external terminal;
- a second external terminal;
- and
- a partial antenna wiring that is coupled to the first external terminal, and that constitutes a matching circuit,
- wherein the chip comprises:
- first and second electrode pads that are coupled to the partial antenna wiring;
- a third electrode pad that is different from each of the first and second electrode pads, and that is coupled to the second external terminal;
- and
- an electrostatic discharge (ESD) protection circuit that is coupled to the third electrode pad.
7 more elements
Dependencies are inferred from the claim text.