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US 8,508,056 B2Granted
Heat releasing semiconductor package, method for manufacturing the same, and display apparatus including the same
AssigneeDongbu HiTek Co., Ltd.
InventorsSung-Jin Kim, Jun-Il Kim
Life of this patent
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Abstract
A heat releasing semiconductor package, a method for manufacturing the same, and a display apparatus including the same. The heat releasing semiconductor package includes a film, an electrode pattern formed over the film, a semiconductor device mounted over the electrode pattern, and a first heat releasing layer formed over the semiconductor device including the electrode pattern, the first heat releasing layer including a first adhesive and a first heat releasing material.
Claims16
A heat releasing semiconductor package comprising:
- a film;
- an electrode pattern formed over the film;
- a semiconductor device mounted over the electrode pattern;
- a first heat releasing layer formed over the semiconductor device including the electrode pattern;
- and
- a first adhesive layer formed interposed between the semiconductor device and the first heat releasing layer,
- wherein the first heat releasing layer comprises an adhesive and a heat releasing material, and
- wherein the first heat releasing layer comprises a nonconductive heat releasing layer.
5 more elements
A heat releasing semiconductor package comprising:
- a film;
- an electrode pattern formed over the film;
- a semiconductor device mounted over the electrode pattern;
- a first heat releasing layer over the semiconductor device including the electrode pattern, wherein the first heat releasing layer comprises an adhesive and a first heat releasing material and wherein the first heat releasing material comprises a nonconductive material;
- a second heat releasing layer formed under the film;
- and
- a first adhesive layer formed interposed between the semiconductor device and the first heat releasing layer,
- wherein the second heat releasing layer comprises an adhesive and a second heat releasing material.
5 more elements
A display apparatus comprising:
- a display panel;
- and
- a heat releasing semiconductor package electrically connected to the display panel, the heat releasing semiconductor package comprising a film, an electrode pattern formed over the film, a semiconductor device mounted over the electrode pattern, and a first heat releasing layer formed over the semiconductor device including the electrode pattern, and a first adhesive layer formed interposed between the semiconductor device and the first heat releasing layer,
- wherein the first heat releasing layer comprises a first adhesive and a first heat releasing material, and
- wherein the first heat releasing layer comprises a nonconductive heat releasing layer.
2 more elements
Dependencies are inferred from the claim text.