Protection film having a plurality of openings above an electrode pad
AssigneePanasonic Corporation
InventorsNoriyuki Nagai, Kiyomi Hagihara
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Abstract
A semiconductor device includes a semiconductor substrate 1, an interlayer insulating film 2, 3 formed on the semiconductor substrate 1, an electrode pad 4 formed on the interlayer insulating film 2, 3, a protective film 6 which is formed on the interlayer insulating film 2, 3 to cover a peripheral portion of the electrode pad 4, and has a first opening 5 which exposes a center portion of the electrode pad 4, a divider 7 which is formed on the electrode pad 4 exposed from the first opening 5, and divides the first opening 5 into a plurality of second openings 5d, and a barrier metal 8 formed on the protective film 6 to fill the second openings 5d. The divider 7 is interposed between the electrode pad 4 and the barrier metal 8.
Claims17
A semiconductor device comprising:
- a semiconductor substrate;
- an interlayer insulating film disposed on the semiconductor substrate;
- an electrode pad disposed on the interlayer insulating film;
- a protective film which is disposed on the interlayer insulating film to cover a peripheral portion of the electrode pad, and has a first opening which exposes a center portion of the electrode pad;
- a divider which is disposed on the electrode pad exposed from the first opening, and divides the first opening into a plurality of second openings;
- and
- a barrier metal disposed on the protective film, wherein
- the divider is interposed between the electrode pad and the barrier metal, and
- a dividing groove which exposes an upper surface of the divider is disposed in the barrier metal wherein a side surface of the divider is inclined in such a manner that an area of a lower surface of the divider is larger than an area of an upper surface of the divider.
A semiconductor device comprising:
- a semiconductor substrate;
- an interlayer insulating film disposed on the semiconductor substrate;
- an electrode pad disposed on the interlayer insulating film;
- a protective film which is disposed on the interlayer insulating film to cover a peripheral portion of the electrode pad, and has a first opening which exposes a center portion of the electrode pad;
- a divider which is disposed on the electrode pad exposed from the first opening, and divides the first opening into a plurality of second openings;
- and
- a barrier metal disposed on the protective film,
- wherein the divider is interposed between the electrode pad and the barrier metal, a dividing groove is disposed in the electrode pad, and the dividing groove is disposed below the divider.
Dependencies are inferred from the claim text.