Electronic device and electronic apparatus
AssigneeSeiko Epson Corporation
InventorShuichi Tanaka
Life of this patent
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Abstract
An electronic device includes a semiconductor device and a wiring substrate having a wiring pattern. The semiconductor device includes: a semiconductor chip having an electrode; a convex-shaped resin protrusion provided on a surface of the semiconductor chip, the surface having the electrode; and wiring having a plurality of electrical coupling sections which are aligned on the resin protrusion and electrically coupled to the electrode. The semiconductor device is mounted to the wiring substrate so that the electrical coupling sections and the wiring pattern are brought into contact and electrically coupled with each other. The plurality of electrical coupling sections brought into contact with the wiring pattern include curved or bent shapes projecting in a longitudinal direction of the resin protrusion.
Claims12
An electronic device, comprising:
- a semiconductor device including:
- a semiconductor chip having a plurality of electrodes;
- a resin protrusion provided on a surface of the semiconductor chip, the surface having the plurality of electrodes;
- and
- wiring having a plurality of electrical coupling sections which are aligned in a first direction on the resin protrusion, the wiring being electrically coupled to the plurality of electrodes;
- and
- a wiring substrate having a wiring pattern, wherein:
- the semiconductor device is mounted to the wiring substrate so that the electrical coupling sections and the wiring pattern are brought into contact and electrically coupled;
- and
- at least one of the electrical coupling sections brought into contact with the wiring pattern include curved shapes projecting in the first direction.
An electronic device, comprising:
- a semiconductor device including:
- a semiconductor chip having a plurality of electrodes;
- a resin protrusion provided on a surface of the semiconductor chip, the surface having the plurality of electrodes;
- and
- wiring having a plurality of electrical coupling sections which are aligned in a first direction on the resin protrusion, the wiring being electrically coupled to the plurality of electrodes;
- and
- a wiring substrate having a wiring pattern wherein:
- the semiconductor device is mounted to the wiring substrate so that the electrical coupling sections and the wiring pattern are brought into contact and electrically coupled;
- and
- at least one of the electrical coupling sections brought into contact with the wiring pattern include bent shapes projecting in the first direction.
Dependencies are inferred from the claim text.