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US 8,508,040 B2Granted
In-situ foam materials as integrated heat spreader (IHS) sealant
AssigneeIntel Corporation
InventorsPaul R. Start, Rahul N. Manepalli
Life of this patent
Estimating the term…
Abstract
An integrated heat spreader (IHS) lid over a semiconductor die connected to a substrate forms a cavity. A bead of foaming material may be placed within the IHS cavity. During an IHS cure and reflow process the foaming material will expand and fill the IHS cavity and the foam's shape conforms to the various surface features present, encapsulating a thermal interface material (TIM) material, and increasing contact area of the foam sealant.
Claims13
An apparatus, comprising:
- a semiconductor die disposed on a substrate;
- a thermal interface material (TIM) disposed over the semiconductor die;
- an integrated heat spreader (IHS) forming a lid over the TIM and the semiconductor die, the IHS forming a cavity between the substrate and the ISH;
- and
- a foamed material substantially filling the cavity.
2 more elements
A system, comprising:
- a semiconductor die electrically connected to a substrate with solder bumps;
- an underfill material between the semiconductor die and the substrate encompassing the solder bumps;
- a thermal interface material (TIM) disposed over the semiconductor die;
- an integrated heat spreader (IHS) forming a lid over the TIM and the semiconductor die, the IHS forming a cavity between the substrate and the ISH;
- a heat sink connected to the IHS;
- and
- a foamed material substantially filling the cavity.
4 more elements
Dependencies are inferred from the claim text.