Back to results
US 8,508,037 B2Granted
Bumpless build-up layer and laminated core hybrid structures and methods of assembling same
AssigneeIntel Corporation
InventorsMathew J. Manusharow, Mark S. Hlad, Ravi K. Nalla
Life of this patent
Estimating the term…
Abstract
A structure includes a hybrid substrate for supporting a semiconductive device that includes a bumpless build-up layer in which the semiconductive device is embedded and a laminated-core structure. The bumpless build-up layer and the laminated-core structure are rendered an integral apparatus by a reinforcement plating that connects to a plated through hole in the laminated-core structure and to a subsequent bond pad of the bumpless build-up layer structure.
Claims15
A semiconductor apparatus comprising:
- a semiconductive die embedded in a bumpless build-up layer (BBUL) structure;
- and
- a laminated-core structure abutting the BBUL structure, wherein the laminated-core structure and the BBUL structure are electrically coupled by an electrically conductive body that is integral to both, wherein the electrically conductive body is a hollow cylinder that is closed on one end thereof.
A semiconductive device comprising:
- a die embedded in a bumpless build-up layer (BBUL), wherein the die includes an active surface and a backside surface, the BBUL including:
- a dielectric first film and a first contact disposed in the dielectric first film and making contact with the die at the active surface;
- and
- a dielectric subsequent film and a subsequent contact disposed in the dielectric subsequent film, wherein the subsequent contact is coupled to the first contact and further including a subsequent contact pad;
- a laminated-core structure assembled at the subsequent contact pad, the laminated core further including:
- a plated through hole (PTH) upon a PTH wall;
- a reinforcement plating that is fused to the PTH and the subsequent contact pad, wherein the reinforcement plating is a hollow cylinder that is closed on one end thereof;
- and
- a land-side structure including:
- land-side contact pads that are coupled to the PTH at laminated-core land-interface bond pads.
7 more elements
Dependencies are inferred from the claim text.