Ultra-thin near-hermetic package based on rainier
AssigneeTessera, Inc.
InventorsKenneth Allen Honer, Philip Damberg
Life of this patent
Estimating the term…
Abstract
A microelectronic package including a dielectric layer having top and bottom surfaces, the dielectric layer having terminals exposed at the bottom surface; a metallic wall bonded to the dielectric layer and projecting upwardly from the top surface of the dielectric layer and surrounding a region of the top surface; a metallic lid bonded to the wall and extending over the region of the top surface so that the lid, the wall and the dielectric layer cooperatively define an enclosed space; and a microelectronic element disposed within the space and electrically connected to the terminals.
Claims15
A microelectronic package comprising:
- (a) a polymeric dielectric layer having top and bottom surfaces, the dielectric layer having terminals exposed at the bottom surface;
- (b) a metallic wall bonded to the dielectric layer and projecting upwardly from the top surface of the dielectric layer and surrounding a region of the top surface;
- (c) a lid bonded to the wall and extending over the region of the top surface so that the lid, the wall and the dielectric layer cooperatively define an enclosed space;
- and
- (d) a microelectronic element disposed within the space and electrically connected to the terminals, the microelectronic element having a front surface, a rear surface, and opposed edges extending between the front surface and the rear surface,
- wherein the metallic wall surrounds the microelectronic element and a region of the top surface of the dielectric layer, and
- wherein the top surface of the metallic wall extends beyond the opposed edges of the microelectronic element, and the bottom surface of the metallic wall extends beyond the opposed edges of the microelectronic element.
A package substrate comprising:
- (a) a polymeric dielectric layer having top and bottom surfaces, the dielectric layer having terminals exposed at the bottom surface;
- and
- (b) a metallic wall having a top surface and a bottom surface, the metallic wall being bonded to the dielectric layer and projecting upwardly from the top surface of the dielectric layer and surrounding a region of the top surface of the dielectric layer thereby defining a partially enclosed space, configured to accommodate a microelectronic element having a front surface and a rear surface,
- wherein the top surface of the metallic wall extends beyond the front surface of the microelectronic element, and the bottom surface of the metallic wall extends beyond the rear surface of the microelectronic element.
A microelectronic package comprising:
- (a) a dielectric layer having top and bottom surfaces, the dielectric layer having terminals exposed at the bottom surface;
- (b) a continuous metallic wall bonded to the dielectric layer, the metallic wall having a top surface and a bottom surface and projecting upwardly from the top surface of the dielectric layer;
- (c) a lid bonded to the wall and extending over the region of the top surface so that the lid, the wall and the dielectric layer cooperatively define an enclosed space;
- and
- (d) a microelectronic element having a front surface and a rear surface, the microelectronic element disposed within the space and electrically connected to the terminals,
- wherein the metallic wall surrounds the microelectronic element and a region of the top surface of the dielectric layer, and
- wherein the top surface of the metallic wall extends beyond the front surface of the microelectronic element, and the bottom surface of the metallic wall extends beyond the rear surface of the microelectronic element.
Dependencies are inferred from the claim text.