Circuit connector apparatus and method therefor

For use in connecting to an external package having a plurality of semiconductor devices in which external connections to the devices are spatially restricted, an apparatus comprising;

• a semiconductor device having first and second opposing surfaces and first and second opposing sidewalls connecting the opposing surfaces, the semiconductor device including first and second different regions and first and second conductive contacts respectively in contact with the first and second different regions, the contacts having access via different surfaces;
• first and second electrodes respectively in contact with the first and second contacts, each electrode extending along at least one surface or sidewall of the semiconductor device that is different than a surface or sidewall along which the other one of the electrodes extends;
• isolating material having an opening therein that exposes the first and second conductive contacts at the first surface, the first and second electrodes extending through the first and second openings to contact the first and second conductive contacts, the isolating material being configured and arranged to electrically insulate the first and second electrodes from one another and from portions of the first and second different regions;
• and
• wherein the first and second electrodes provide electrical connections to the respective first and second contacts via external connectors adjacent different surfaces or sidewalls of the semiconductor device, and
• the isolating material electrically isolates the first and second electrodes respectively from all portions of the semiconductor device except the contact that the electrode physically contacts.

A method for manufacturing a semiconductor device for use in connecting to an external package having a plurality of semiconductor devices in which external connections to the devices are spatially restricted, the method comprising:

• forming isolating material on sidewalls and on a first surface of a semiconductor device, the semiconductor device also having a second surface opposing the first surface and first and second opposing sidewalls extending between the opposing surfaces, the isolating material haying an opening that exposes a first conductive contact in the first surface and in contact with a first different region in the semiconductor device;
• forming a first electrode on portions of the isolating material that are on the first surface and on at least one of the sidewalls, and extending through the opening and in contact with the first contact;
• and
• forming a second electrode in electrical contact with a second different region via a second contact, extending along one of the sidewalls that is different than a sidewall along which the first electrode extends, therein providing access to the first and second contacts via different external connectors adjacent different sidewalls or surfaces;
• and
• wherein
• forming the isolating material includes
• forming a first isolating material on the first surface of a semiconductor wafer and having an opening therein exposing the second contact,
• removing a portion of the isolating material and the semiconductor wafer to form the semiconductor device having exposed sidewalls,
• inverting the semiconductor device to present the sidewalls and the second surface, and
• forming a second isolating material on the exposed sidewalls and on the second surface, the second isolating material contacting the first isolating material on the first surface,
• forming the second electrode includes forming the second electrode to contact the second contact in the first surface, via the opening in the first isolating material, and extending along the first isolating material on the first surface, and along the second isolating material on the second sidewall and on the second surface.

A method for manufacturing a semiconductor device for use in connecting to an external package having a plurality of semiconductor devices in which external connections to the devices are spatially restricted, the method comprising:

• forming isolating material on sidewalls and on a first surface of a semiconductor device, the semiconductor device also having a second surface opposing the first surface and first and second opposing sidewalls extending between the opposing surfaces, the isolating material having an opening that exposes a first conductive contact in the first surface and in contact with a first different region in the semiconductor device;
• forming a first electrode on portions of the isolating material that are on the first surface and on at least one of the sidewalls, and extending through the opening and in contact with the first contact;
• and
• forming a second electrode in electrical contact with a second different region via a second contact, extending along one of the sidewalls that is different than a sidewall along which the first electrode extends, therein providing access to the first and second contacts via different external connectors adjacent different sidewalls or surfaces;
• and
• wherein forming the second electrode includes forming the second electrode in direct contact with the second surface, the second contact being in the second surface.

A method for manufacturing a semiconductor device for use in connecting to an external package having a plurality of semiconductor devices in which external connections to the devices are spatially restricted the method comprising:

• forming isolating material on sidewalls and on a first surface of a semiconductor device, the semiconductor device also having a second surface opposing the first surface and first and second opposing sidewalls extending between the opposing surfaces, the isolating material haying an opening that exposes a first conductive contact in the first surface and in contact with a first different region in the semiconductor device;
• forming a first electrode on portions of the isolating material that are on the first surface and on at least one of the sidewalls, and extending through the opening and in contact with the first contact;
• and
• forming a second electrode in electrical contact with a second different region via a second contact, extending along one of the sidewalls that is different than a sidewall along which the first electrode extends, therein providing access to the first and second contacts via different external connectors adjacent different sidewalls or surfaces;
• doping the device to form the first and second different regions, and
• forming the first and second contacts respectively in contact with the first and second different regions.