Electronic devices

A semiconductor device, comprising:

• a package structure having a die mounting area over a surface thereof within a cavity, the package structure further including a sidewall of the cavity extending above the surface and facing the die mounting area, at least a portion of the sidewall inclined at an outward angle of greater than about 90° relative to the surface;
• at least one contact pad exposed on an interior surface of the cavity;
• a semiconductor die in the die mounting area electrically connected to the at least one contact pad;
• at least one attachment pad exposed on a surface of the package structure other than the surface;
• at least one conductive structure passing through the package structure and electrically connecting the at least one contact pad and the at least one attachment pad;
• and
• an optically transparent lens within the cavity isolated from direct contact with the semiconductor die.

A packaged semiconductor chip, comprising:

• a substrate structure having a first surface, an opposing, second surface, and a raised sidewall protruding above the first surface, extending along a perimeter of the substrate structure and defining a chip cavity, the raised sidewall comprising an upwardly facing, inclined surface surrounding the chip cavity;
• a semiconductor chip over the first surface within the chip cavity;
• a transparent lens element within the chip cavity, the transparent lens element insulated from contact with the semiconductor chip;
• at least one contact pad exposed adjacent the first surface and electrically connected to the semiconductor chip;
• at least one attachment pad exposed adjacent the second surface;
• and
• at least one conductive path electrically connecting the at least one contact pad to the at least one attachment pad through the substrate structure.

A packaged electronic device, comprising:

• a structure having a first surface and including a sidewall surrounding the first surface to form a die cavity, the sidewall having at least a portion thereof oriented at an outward angle relative to the first surface of greater than about 90°;
• at least one contact pad adjacent the first surface;
• a semiconductor die located above the first surface within the die cavity and electrically connected to the at least one contact pad;
• an optically clear lens within the chip die extending over the semiconductor die and isolated from direct contact with the semiconductor die;
• at least one attachment pad adjacent another surface of the structure;
• and
• at least one conductor passing through the structure and electrically connecting the at least one contact pad and the at least one attachment pad.

A chip package, comprising:

• a substrate structure having a chip mounting surface, an opposing surface, and a raised sidewall protruding above the chip mounting surface, extending along a perimeter of the substrate structure and bounding a chip cavity, the raised sidewall comprising an upwardly facing, inclined surface adjacent to the chip cavity;
• at least one contact pad exposed adjacent the chip mounting surface;
• a semiconductor chip disposed in the chip cavity and electrically connected to the at least one contact pad;
• a transparent cover having a optical focusing structure extending over the semiconductor chip within the chip cavity and out of contact with the semiconductor chip;
• at least one attachment pad exposed adjacent the opposing surface;
• and
• at least one conductive path electrically connecting the at least one contact pad to the at least one attachment pad through the substrate structure.