Chip packaging

A method of manufacturing an electronic device package, the method comprising:

• attaching to an electronic device having a set of contact pads thereon a set of electrically conductive contact members, each contact member extending between a respective external contact point and an internal contact point from which it is electrically coupled to a respective contact pad on the electronic device, each internal contact point being outside the footprint of the electronic device and the set of contact members including at least one contact member of a first type having an external contact point that is located at least partially within the footprint of the electronic device, a depth at its internal contact point that is less than its depth at its external contact point, and a width at its internal contact point that is less than its width at its external contact point, said width being parallel to the nearest side of the electronic device to said internal contact point, and at least one contact member of a second type that is wholly outside the footprint of the device;
• and
• encapsulating the device in a block of insulating material such that the external contact points of the contact members are exposed at the surface of the block.