LED module
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsTai-Cherng Yu, Chun-Yu Lin
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Abstract
An exemplary LED module includes a ceramic substrate, a heat spreader, a heat sink, an LED die, and a packaging layer. The substrate defines a hole extending therethrough from a top side to a bottom side thereof. The heat spreader is disposed in the hole with a top side thereof substantially coplanar with the top side of the substrate. An outer circumferential surface of the heat spreader contacts an inner circumferential surface of the substrate around the hole. The heat sink is attached to the top sides of the substrate and the heat spreader. The LED die is attached to a bottom side of the heat spreader, and the packaging layer encapsulates the LED die.
Claims9
An LED module, comprising:
- a ceramic substrate forming a layer of circuits, the substrate defining a hole therein;
- a heat spreader disposed in the hole of the substrate and contacting the substrate, the heat spreader comprising a chamber and working fluid received in the chamber;
- an LED die attached to the chamber of the heat spreader and electrically connected to the circuits of the substrate;
- and
- a packaging layer encapsulating the LED die, and connecting the LED die, the heat spreader and the substrate integrally.
Dependencies are inferred from the claim text.