Integrated circuit packaging system with connection supports and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Emmanuel Espiritu, Henry Descalzo Bathan
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a connection structure having a component pad, an outer pad, and an inner pad, the inner pad between the component pad and the outer pad; forming a support structure between the inner pad and the outer pad; mounting an integrated circuit device over the component pad; attaching an interconnect to the integrated circuit device and the outer pad, the interconnect above the inner pad and supported by the support structure; and applying an encapsulation over the connection structure, the interconnect, and the integrated circuit device.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a connection structure having a component pad, an outer pad, and an inner pad, the inner pad between the component pad and the outer pad;
- forming a support structure between the inner pad and the outer pad;
- mounting an integrated circuit device over the component pad;
- attaching an interconnect to the integrated circuit device and the outer pad, the interconnect is a continuos and above the inner pad and supported by the support structure;
- and
- applying an encapsulation over the connection structure, the interconnect, and the integrated circuit device.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a connection structure having a component pad, an outer pad, and an inner pad, the inner pad between the component pad and the outer pad;
- forming a support structure between the inner pad and the outer pad;
- mounting an integrated circuit device over the component pad;
- attaching a first interconnect is a continuous and to the integrated circuit device and the outer pad, the first interconnect is a continuos and above the inner pad and supported by the support structure;
- attaching a second interconnect to the integrated circuit device and the inner pad;
- and
- applying an encapsulation over the connection structure, the first interconnect, the second interconnect, and the integrated circuit device.
An integrated circuit packaging system comprising:
- a connection structure having a component pad, an outer pad, and an inner pad, the inner pad between the component pad and the outer pad;
- a support structure between the inner pad and the outer pad;
- an integrated circuit device over the component pad;
- an interconnect is a continuous and attached to the integrated circuit device and the outer pad, the interconnect above the inner pad and supported by the support structure;
- and
- an encapsulation over the connection structure, the interconnect, and the integrated circuit device.
Dependencies are inferred from the claim text.