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US 8,508,025 B2Granted
Folded leadframe multiple die package
AssigneeFairchild Semiconductor Corporation
InventorsYong Liu, Tiburcio A. Maldo, Hua Yang
Life of this patent
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Abstract
A multiple die package includes a folded leadframe for interconnecting at least two die attached to another leadframe. In a synchronous voltage regulator the folded leadframe, which is formed from a single piece of material, connects the high side switching device with the low side switching device to provide a low resistance, low inductance connection between the two devices.
Claims17
A synchronous voltage converter at least partially encapsulated in encapsulating material, comprising:
- first and second mosfets, each having a source terminal and gate terminal on one side of and a drain terminal on its other side;
- a folded metal lead frame having a die attach metal plate and a source attach metal plate, said attach metal plates vertically spaced from each other and joined together along opposite corresponding edges by a metal belt member,
- a planar metal lead frame having a die attach section and a source attach section, the die and source attach sections are laterally spaced from each other and each attach section has at least one lead extending outside the encapsulating material;
- wherein
- the first mosfet is attached to the die attach section of the planar metal lead frame and the source of the first mosfet is attached to the source attach plate, and
- the second mosfet is attached to the die attach metal plate and the source of the second mosfet is attached to source attach section of the planar metal lead frame.
3 more elements
A synchronous voltage converter at least partially encapsulated in encapsulating material, comprising:
- an integrated circuit and first and second mosfets, each mosfet having a source terminal and gate terminal on one side of each die and a drain terminal on its other side;
- a folded metal lead frame having a die attach metal plate and a source attach metal plate, said attach metal plates vertically spaced from each other and joined together along opposite corresponding edges by a metal belt member,
- a planar metal lead frame having a die attach section and a source attach section, the die and source attach sections are laterally spaced from each other and each attach section has at least one lead extending outside the encapsulating material;
- wherein
- the first mosfet is attached to the die attach section of the planar metal lead frame and the source of the first mosfet is attached to the source attach plate of the folded metal lead frame, and
- the second mosfet is attached to the die attach metal plate of the folded metal lead frame and the source of the second mosfet is attached to source attach section of the planar metal lead frame;
- and
- the integrated circuit is attached to the die attach section of the planar lead frame and electrically connected to the first and second mosfets.
5 more elements
Dependencies are inferred from the claim text.