Ultra thin package for electric acoustic sensor chip of micro electro mechanical system

An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system, comprising:

• a substrate comprising a first substrate surface and a second substrate surface opposite to the first substrate surface;
• a shielding layer embedded within the substrate between the first substrate surface and second substrate surface for preventing electro magnetic interference;
• at least one conductor bump formed on the second substrate surface;
• an electric acoustic sensor chip having a first chip surface, a second chip surface opposite to the first chip surface, and a side surface, wherein the first chip surface is electrically connected to the conductor bump, wherein the conductor bump is positioned between the second substrate surface and the first chip surface to create a space, and wherein the conductor bump is used for transferring a signal from the electric acoustic sensor chip to the substrate;
• a back acoustic chamber plate disposed on and contacting the second chip surface, wherein a side of the back acoustic chamber plate does not extend beyond the side surface of the electric acoustic sensor chip;
• an acoustic opening passing through the substrate;
• a chamber positioned between the second substrate surface and the first chip surface and communicating with the acoustic opening, wherein the chamber is formed by sealing the outer surroundings of the space with a filling layer;
• and
• at least one conductor ball formed on the second substrate surface outside of the electric acoustic sensor chip, adjacent to both the filling layer and the electric acoustic sensor chip, and electrically connected to a system point for transferring the signal from the substrate to the system point.

An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system, comprising:

• a substrate comprising a first substrate surface and a second substrate surface opposite to the first substrate surface;
• a shielding layer embedded within the substrate between the first substrate surface and second substrate surface for preventing electro magnetic interference;
• at least one conductor bump formed on the second substrate surface;
• an electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface, wherein the first chip surface is electrically connected to the conductor bump, wherein the conductor bump is positioned between the second substrate surface and the first chip surface to create a space, and wherein the conductor bump is used for transferring a signal from the electric acoustic sensor chip to the substrate;
• an acoustic opening passing through the substrate;
• a chamber positioned between the second substrate surface and the first chip surface and communicating with the acoustic opening, wherein the chamber is formed by sealing the outer surroundings of the space with a filling layer, wherein the filling layer comprises an extended layer extending outward to fill a region on the second substrate surface adjacent to the electric acoustic sensor chip;
• and
• a conductor plug passing through the extended layer outside of the electric acoustic sensor chip, and electrically connected to the second substrate surface for transferring the signal from the substrate to the system point, wherein the substrate and the system point are connected by the conductor plug.