Semiconductor apparatus and method of manufacturing the same

A semiconductor apparatus including

• a substrate,
• a pixel array arranged on the substrate,
• a first conductive pad which is arranged on the substrate and electrically connected to a circuit element of the pixel array, and
• a second conductive pad arranged under the substrate to connect an electronic circuit, the apparatus comprising:
• an insulating layer arranged between the substrate and the first conductive pad;
• a third conductive pad arranged between the substrate and the insulating layer;
• a first conductive member which passes through a first contact hole extending through the insulating layer, and connects the first conductive pad and the third conductive pad to each other;
• and
• a second conductive member which passes through a second contact hole extending through the substrate, and connects the second conductive pad and the third conductive pad to each other,
• wherein the pixel array further comprises a conductive line connected to circuit elements included in a plurality of pixels aligned in one of a row direction and a column direction, and
• the first conductive pad is connected to the conductive line in an interval between the plurality of pixels aligned in the one of the row direction and the column direction.