Solid-state imaging device, method of manufacturing the same, and camera and electronic apparatus using the same
AssigneeSony Corporation
InventorShunsuke Maruyama
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a solid-state imaging device is provided. The method includes: forming an insulating layer extending over an effective pixel region where a plurality of pixels each having a photoelectric conversion element is arranged and a peripheral area adjacent to the effective pixel region; forming an opening in the insulating layer located immediately above the photoelectric conversion element on the effective pixel region; forming a dummy opening in the insulating layer on the peripheral region; and forming a buried layer on the insulating layer to fill the opening and the dummy opening formed in the insulating layer.
Claims11
A solid-state imaging device that includes (a) an effective pixel region, where a plurality of pixels, each having a photoelectric conversion element, is arranged, and (b) a peripheral area adjacent to the effective pixel region, the device comprising:
- an opening in an insulating layer above the photoelectric conversion element on the effective pixel region;
- a shading film in an insulating layer of the peripheral area;
- a dummy opening above the shading film in the peripheral area;
- and
- a buried layer filling both the opening and the dummy opening and that is made of an insulating material.
A camera including
- a solid-state imaging device;
- an optical system configured to introduce incident light into a photoelectric conversion element of the solid-state imaging device;
- and
- a signal processing circuit configured to process a signal output from the solid-state imaging device, the solid-state imaging device comprising:
- an effective pixel region, where a plurality of pixels each having the photoelectric conversion element is arranged;
- a peripheral area adjacent to the effective pixel region;
- an opening in an insulating layer above the photoelectric conversion element on the effective pixel region;
- a shading film in an insulating layer of the peripheral area;
- a dummy opening above the shading film in the peripheral area;
- and
- a buried layer filling both the opening and the dummy opening and that is made of an insulating material.
An electronic apparatus including a camera having a solid-state imaging device, an optical system configured to introduce incident light into a photoelectric conversion element of the solid-state imaging device, and a signal processing circuit configured to process a signal output from the solid-state imaging device, the solid-state imaging device comprising:
- an effective pixel region, where a plurality of pixels each having the photoelectric conversion element is arranged;
- a peripheral area adjacent to the effective pixel region;
- an opening in an insulating layer above the photoelectric conversion element on the effective pixel region;
- a shading film in an insulating layer of the peripheral area;
- a dummy opening above the shading film in the peripheral area;
- and
- a buried layer filling both the opening and the dummy opening and that is made of an insulating material.
Dependencies are inferred from the claim text.