Heat dissipation by through silicon plugs
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Hung-Pin Chang, Yung-Chi Lin, Chia-Lin Yu, Jui-Pin Hung, Chien Ling Hwang
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Abstract
The package substrates with through silicon plugs (or vias) described above provide lateral and vertical heat dissipation pathways for semiconductor chips that require thermal management. Designs of through silicon plugs (TSPs) with high duty ratios can most effectively provide heat dissipation. TSP designs with patterns of double-sided combs can provide high duty ratios, such as equal to or greater than 50%. Package substrates with high duty ratios are useful for semiconductor chips that generate large amount of heat. An example of such semiconductor chip is a light-emitting diode (LED) chip.
Claims20
A semiconductor package substrate with through silicon plugs to dissipate heat generated by a packaged semiconductor chip, comprising:
- a substrate with through silicon plugs (TSPs) on the semiconductor package substrate, wherein the TSPs extend from a first surface of the semiconductor package substrate to a second surface opposite to the first surface, wherein a cross-section of the TSPs show a pattern of double-sided combs, the double-sided combs including at least two TSPs contiguously connected by a thermally conductive material disposed within a material of the substrate, and wherein the TSPs provide heat dissipation pathways for the semiconductor chip.
A semiconductor package substrate with through silicon plugs to dissipate heat generated by a semiconductor chip being packaged, comprising:
- a substrate with through silicon plugs (TSPs) on the semiconductor package substrate, wherein the TSPs extend from a first surface of the semiconductor package substrate to a second surface opposite to the first surface, wherein the TSPs have a duty ratio equal to or greater than about 50%, and a cross-section of the TSPs show a pattern of double-sided combs, the double-sided combs including at least two TSPs contiguously connected by a thermally conductive material disposed within a material of the substrate.
Dependencies are inferred from the claim text.