Light emitting diode package and method for manufacturing the same
AssigneeAdvanced Optoelectronics Technology, Inc.
InventorsChao-Hsiung Chang, Chieh-Ling Chang, Pi-Chiang Hu
Life of this patent
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Abstract
An exemplary light emitting diode (LED) package includes a substrate having a first electrical portion and a second electrical portion formed thereon, two antioxidation layers formed on and electrically connected to the first electrical portion and the second electrical portion, respectively, and an LED chip disposed on the substrate and electrically connected to the two antioxidation layers.
Claims18
A light emitting diode (LED) package, comprising:
- a substrate having a first electrical portion and a second electrical portion formed thereon;
- two antioxidation layers formed on and electrically connected to the first electrical portion and the second electrical portion, respectively;
- an LED chip disposed on the substrate and electrically connected to the two antioxidation layers;
- a reflecting layer formed on the substrate between the two antioxidation layers;
- and
- an insulating block covering the reflecting layer, wherein the insulating block cooperates with the substrate to enclose the reflecting layer therein.
A method for manufacturing a light emitting diode (LED) package comprising following steps:
- providing a substrate having a first electrical portion and a second electrical portion formed thereon;
- forming a reflecting layer on the substrate;
- providing an insulating block covering the reflecting layer;
- forming two antioxidation layers on the first electrical portion and the second electrical portion, respectively;
- and
- providing an LED chip mounted on the insulating block and electrically connected to the first electrical portion and the second electrical portion;
- wherein a top face of the insulating block is coplanar with top faces of the antioxidation layers.
A method for manufacturing a light emitting diode (LED) package comprising following steps:
- providing a substrate having a first electrical portion and a second electrical portion formed thereon;
- forming a reflecting layer on the substrate;
- providing an insulating block covering the reflecting layer;
- forming two antioxidation layers on the first electrical portion and the second electrical portion, respectively;
- and
- providing an LED chip mounted on the insulating block and electrically connected to the first electrical portion and the second electrical portion;
- wherein the insulating block cooperates with the substrate to enclose the reflecting layer therein.
Dependencies are inferred from the claim text.