Organic light emitting diode display including a sealant auxiliary structure and method of manufacturing the same
AssigneeSamsung Display Co., Ltd.
InventorsByung-Uk Han, Hee-Chul Jeon
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Abstract
An organic light emitting diode (OLED) display includes: a first substrate including an OLED; a second substrate that is opposite to the first substrate; a sealant that is positioned between the first substrate and the second substrate and that couples the first substrate and the second substrate; and a sealant contraction reinforcement auxiliary structure that is positioned in at least one of a position between the first substrate and the sealant and a position between the second substrate and the sealant.
Claims18
An organic light emitting diode (OLED) display device, comprising:
- a first substrate comprising an OLED;
- a second substrate that is opposite to the first substrate;
- a sealant that is positioned between the first substrate and the second substrate and that couples the first substrate and the second substrate;
- and
- a sealant contraction reinforcement auxiliary structure, that is positioned in a position between the first substrate and the sealant or a position between the second substrate and the sealant, or in both positions,
- wherein a thermal expansion coefficient of the sealant contraction reinforcement auxiliary structure is less than a thermal expansion coefficient of the sealant,
- wherein the thermal expansion coefficient of the sealant contraction reinforcement auxiliary structure is between about 40×10−6/K, to about 65×10−6/K.
A method of manufacturing an OLED display device, the method comprising:
- preparing a first mother board comprising a plurality of OLEDs;
- forming a plurality of sealants that enclose a plurality of OLEDs, respectively, a plurality of sealant contraction reinforcement auxiliary structures that are positioned between the sealant and the second mother board, and a dummy structure that is adjacent to the sealant and that has the same height as that of the sealant on the second mother board;
- cohering the first mother board and the second mother board using the plurality of sealants so that the plurality of sealants enclose the plurality of OLEDs, respectively;
- curing the sealant;
- and
- cutting the first mother board and the second mother board along the outer side of the sealant,
- wherein a thermal expansion coefficient of the sealant contraction reinforcement auxiliary structure is less than a thermal expansion coefficient of the sealant,
- wherein the thermal expansion coefficient of the sealant contraction reinforcement auxiliary structure is between about 40×10−6/K, to about 65×10−6/K.
Dependencies are inferred from the claim text.