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US 8,507,926 B2Granted
Light emitting diode package
AssigneeCoretronic Corporation
InventorsChao-Hung Weng, Fu-Ming Chuang
Life of this patent
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Abstract
A light emitting diode package includes a substrate, a plurality of light emitting diode chips, a fluorescence layer, and a plurality of reflecting layers. The light emitting diode chips, the fluorescence layer, and the reflecting layers are disposed on the substrate. The fluorescence layer covers the light emitting diode chips, and the reflecting layers are disposed right above the light emitting diode chips, respectively.
Claims10
A light emitting diode package, comprising:
- a substrate;
- a plurality of light emitting diode chips, disposed on the substrate;
- a fluorescence layer, disposed on the substrate and covering the light emitting diode chips;
- and
- a plurality of reflecting layers, disposed above the fluorescence layer and right above the light emitting diode chips respectively, wherein the reflecting layers are disposed on a same level, the fluorescence layer has a light emitting surface, and the plurality of reflecting layers cover a top part of the light emitting surface, and do not cover other top parts of the light emitting surface.
2 more elements
Dependencies are inferred from the claim text.